About this item

• THERMAL CONDUCTIVE PAD – It effectively dissipates significant amounts of heat 8W/(m·K) thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide
• FLEXIBLE STRUCTURE – The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity
• USED IN VARIOUS SCENARIOS – It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces
• GREAT RESULTS – By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components
• THERMAL CONDUCTIVITY – With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements