Thermal interface deployment protocols

Contaminants, factory thermal paste residues, and finger oils compromise interface efficiency. Clean the coldplate and bare silicon die with 99.9% electronic-grade isopropanol using lint-free microfiber swabs before applying any interface.

Ensure complete solvent evaporation before proceeding. Inspect die perimeter capacitors under bench magnification to confirm zero particulate bridging prior to compound deposition.

Electrically conductive compound application

Dielectric perimeter isolation

Controlled needle dispensation

Tension break and surface tinning

Cooler base matching

Tin a matching micro-layer of Conductonaut onto the cooler coldplate mating surface to guarantee uniform alloy contact across the thermal junction.

Apply TG Shield or high-temperature conformal coating across all surface-mount SMD components surrounding the bare silicon die to prevent short circuits.

Thread the precision black applicator tip onto the Conductonaut syringe. Dispense a single pinhead droplet directly onto the center of the nickel-plated copper substrate.

Use the supplied lint-free cotton swab to actively work the gallium droplet across the contact area until it completely wets the substrate surface.

Graphene dry-mount installation

Dimension tolerance verification

Dry non-adhesive placement

Uniform axial coldplate torque

Select the pre-cut KryoSheet matching the exact silicon die footprint. Structural graphene must never overlap perimeter components or touch chassis ground.

Use non-magnetic tweezers to position the sheet dry onto the bare die. Do not apply thermal grease, cleaning fluid, or oils to the sheet surface.

Lower the heatsink coldplate squarely onto the assembly without twisting. Fasten retention screws in an alternating diagonal sequence to maintain uniform mounting pressure.

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