
Thermal interfaces engineered for precision hardware






KryoSheet graphene thermal pads
Solid-state carbon structure eliminates pump-out and dry-out across bare-die graphics processors and server CPUs. Anisotropic thermal conductivity provides industrial heat dissipation without curing schedules or liquid migration.
Conductonaut gallium alloy
High-efficiency eutectic alloy formulated strictly for nickel-plated copper coldplates and direct silicon heat spreaders. Demands non-conductive barrier coatings over exposed SMD capacitors and complete exclusion from aluminium radiators.
PhaseSheet and Minus Pad series
Formulated for uneven height differentials across video memory banks and voltage regulator modules. Viscoelastic compliance fills component gaps without excessive mechanical PCB deflection or oil leaching into board traces.
Electrical conductivity and coldplate criteria
KryoSheet dry installation protocol
Conductonaut electrical isolation criteria
Graphene microstructures require zero paste layering or liquid primers. Pre-cut dimensional sheets must sit flush against silicon without perimeter folding to prevent air pocket insulation under standard spring-tension brackets.
Gallium alloys are electrically conductive and will rapidly amalgamate with aluminium heatsinks. Technicians must verify nickel-plated contact surfaces, apply conforming protective lacquer to perimeter resistors, and meter exact mechanical mounting pressure.
Aeronaut and Kryonaut paste tolerance
Silicone and metal oxide compounds formulated for non-conductive application on standard integrated heat spreaders. Designed for standard desktop assemblies where electrical isolation must remain entirely non-critical.
Verify deployment standards before breaking package seals
Access workshop datasheets, chemical compatibility warnings, and volume carton pricing through official UK trade channels.
